About Us
Our core competencies include Through-Glass Vias (TGVs), interposers, high-density interconnects, and microfluidic structures — enabling the development of cutting-edge devices in microelectronics and life sciences.
Our core values — precision, integrity, and consistency — are embedded in everything we do. We take pride in meeting deadlines with precision, operating with transparency and trust, and maintaining unwavering quality across every project. These principles guide our mission to be a reliable, innovative partner to our clients worldwide.
Advantages of our Micro-fabrication process
- Mask-less Direct-Write Etching Process
- High Etch rate of up-to 70 μm/s achievable
- Etches all types of Glass Substrates - Borosilicate, Soda Lime, Quartz, and Fused Silica
- Versatile fabrication capability - Features such as Through and Blind Holes, Micro-channels, Pockets, among others
- High Aspect Ratio Machining up-to 1:10
- Enables cost-effective, cleanroom-free processing
- Eliminates the need for chemical etching in post-processing
- Reduced dependency of High-Skill manpower
- Low CAPEX and OPEX for machine
- Capability Configurable for Batch and Mass Manufacturing Throughput




