ASEAN-India Summit Bali, Indonesia
ASEAN-India Summit Group Photo
ASEAN-India Summit Bali
I-Stem Presentation Felicitation
TiE Bengaluru Runner-up Award for Innovation Category
NIRMAN Acceleration Award by SIIC IIT Kanpur
TiE Global Summit Bengaluru Presentation
TGS 2024
TECHNOVATION Award by IESA and Texas Instrument
CII YI INNOVERGE Award Felicitation
Winner Beyond Bengaluru 2022
STPI Presentation
CII YI INNOVERGE Presentation
100 Micron Through Hole on Glass Wafer
High Density Through Hole Packaging for 2.5D and 3D Stacking of Chips
200 Micron Through Hole on Glass Wafer
300 Micron Through Hole on Glass Wafer
100, 200, 300, 400, and 500 Micron Through Holes on Glass Wafer
Circular Die with two anchor points
Large Through Holes/ Slots on Glass Wafers
4mm Height 2.5mm Diameter Die
Serpentine Micro-channels on Glass Wafer
4mm height 1mm Diameter Glass Pillars
Glass Wafers with Multi-Feature Capability
Glass Wafer with Multi-Feature Capability
Droplet Microfluidic Patterns on Glass Wafers
Spiral Microfluidic Channels
Droplet Microfluidic Structures on Glass Wafers
Glass Micro-pillars for Deterministic Lateral Displacement (DLD) Microfluidics
Straigh Channel Micro-fluidics
Constriction Based Micro-channels on PMMA Substrates
Micro-channels on PMMA Substrates
Complex Microfluidic Devices for Biomedical Applications
Magnetic Sensor PCB designed using KiCAD
Low-Flow rate Near-Pulseless Syringe Pump for Microfluidic Applications
Custom ESP32 PCB Designed using KiCAD
